Mechanical Design and Engineering
Obsidian Solutions Group provides full-spectrum mechanical design and engineering services to support defense and government programs through all phases of development—from concept to production-ready hardware. Our disciplined approach ensures designs are optimized for performance, manufacturability, qualification, and operational reliability in demanding environments, delivering mission-critical solutions that meet stringent DoD and federal requirements.
High-fidelity 3D modeling and parametric design using industry-standard CAD platforms to develop precise geometry for complex mechanical systems, subassemblies, and components, enabling seamless integration with additive manufacturing, machining, and assembly processes while maintaining full configuration control and revision traceability.
Computational Fluid Dynamics (CFD), and Thermal Simulations — Advanced structural, dynamic, fluid flow, and thermal analyses to validate design performance under operational loads, environmental extremes, and mission-specific conditions; results inform design iterations, risk reduction, and compliance with qualification and acceptance criteria prior to prototyping and testing.
Rigorous evaluation and down-selection of engineering-grade materials—including metals, composites, and high-performance polymers—based on mechanical properties, environmental resistance, MIL-STD compliance, supply chain availability, and cost/schedule constraints to ensure long-term durability and mission assurance in harsh operational theaters.
Design for Manufacturing and Assembly (DFMA) assessments conducted early and iteratively to optimize producibility, reduce touch labor, minimize defects, and accelerate transition to low-rate initial production (LRIP); includes tolerance stack-up studies, fastener selection, tooling considerations, and producibility reviews to support repeatable, cost-effective builds compliant with quality management systems.
Electrical Design and Engineering
End-to-end printed circuit board development, including schematic capture, multi-layer layout, high-speed signal integrity analysis, and Design for Manufacturability (DFM) reviews using industry- standard tools; supported by in-house low- to medium-volume assembly, component placement, soldering, conformal coating, and functional verification to deliver production-ready boards for prototypes, LRIP, and fielded systems.
Architecture-level design of complex electro- mechanical systems, including power distribution, analog/digital signal processing, control interfaces, EMI/EMC mitigation, and interconnect strategies; designs are optimized for size, weight, power (SWaP), environmental ruggedness, and interoperability to meet operational mission profiles in harsh defense environments.
Formulation of detailed test plans, procedures, and acceptance criteria for electrical performance, RF characteristics, environmental qualification, and system-level integration testing; aligned with DoD T&E standards to support risk reduction, design validation, and formal qualification/certification prior to production release or field deployment.
Custom sensor solution development and seamless integration into mechanical platforms, including selection and packaging of accelerometers, gyroscopes, pressure/temperature transducers, optical, acoustic, and RF sensors; encompasses interface design, signal conditioning, calibration, environmental sealing, and performance validation to ensure accurate data acquisition and reliability under operational stresses.
Embedded software and firmware integration for microcontrollers, FPGAs, and single-board computers, including driver development, real-time control algorithms, communication protocols (e.g., CAN, UART, Ethernet), and interface bridging to higher-level systems; supports rapid prototyping, iterative debugging, and configuration-managed builds to enable fully functional, software- defined electro-mechanical assemblies ready for test and fielding.
